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Premium Partner of the Electronics Industry

Diamond SSG grinding wheels for wafer grinding

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Karin McQuillian

Industry Group Manager

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Tyrolit expertise

Innovative ring wheels for semiconductor manufacturing

With its assortment for grinding wafers and a partnership with diamond tool manufacturer Asahi, Tyrolit has established itself as an innovative partner to the semiconductor industry. Both companies use synergy effects from which customers benefit worldwide.

The composition of our abrasives with an optimized diamond quality, a special bond system and a unique carrier body design, which is manufactured by Asahi, guarantees lowest grinding forces during the grinding process. In combination with a grit size of less than 1 μm results in improved surface quality and greatly increased flexural strength of up to 100%.

In addition, our specialists will help you to make process adjustments and thus achieve excellent profitability of your production.

1µm

Grit size

Grinding tools with grit sizes of 1µm are used for grinding wafers.

1.15 trillion

Semiconductors

The electronics industry sold a total of 1.15 trillion semiconductors in 2021.

Pioneering work

Our solutions for the electronics industry

Tyrolit accompanies its customers in the electronics industry with a range of high quality surface grinding wheels that make a difference in the market.

The product range for grinding wafers enables the highest quality surfaces to be achieved with significantly improved breaking strength. This is achieved thanks to an innovative process design by our application experts and the continuous development of our products. The following are the most important advantages:

Innovative products resulting in reduced grinding forces and cool finishes for highly economical processes
Highest surface quality and breaking strength
Highly specialized know-how provided by our application engineers
Large stock range with quickly deliverable products

Downloads

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Here you can find more information about our products in this industry.

Economic efficiency with CENTURIA-E

CENTURIA-E achieves the highest quality surfaces with a significantly improved die strength ratio for the surface grinding of wafers. Optimised diamond qualities, a special bond system and a unique core design produced at Asahi, guarantee lowest grinding forces. In combination with specific process adjustments, outstanding economic efficiency can be reached.

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Customized

Solutions for the highest demands

Successful companies expect process know-how and comprehensive consulting services from their partners.

Together with the customer, our application engineers analyze the task at hand, create customized solution proposals and implement them on site on the machine.

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