We appreciate your interest and will get back to you as soon as possible to prepare a quote. In the meantime, feel free to discover more products on our website.
Product variants
-
Shape
-
Dimensions
-
Specification
- Shape
- Type number
- Dimensions
- Mounting
- Specification
- Delivery unit
90 H
- 95717
- 150
- 25 - 10 - 2
- 11D 39 C50 B 52 AL
- 1
- 91963
- 150
- 40 - 10 - 2
- 11D 39 C50 B 52 AL
- 1
Product information
Description
The resin-bonded lappers are primarily used for deburring and lapping extremely hard materials. They are therefore the common choice for whetting tungsten carbide cutting edges. This product is only available in a diamond grain design with a grit size of D35.
Applications
- For deburring and lapping very hard materials, primarily for trueing carbide cutting edges
Abrasive Grain
- Diamond (D)
Bond Classification
Resin
Recommendations
Explore related products
Discover more
Ceramic bond flat sticks
for steel, stainless steel and tungsten carbideHand-operated grinding
Discover more
Combination stone ceramic bonded
for steel, stainless steel, nonferrous metals and cast ironHand-operated grinding
B2B Shop Registration