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Product information
Description
The innovative SKYTEC BOLT metal bond was specially developed for the patented Agathon PowerGrind process. Spark erosion enables the grinding wheel to be continuously and simultaneously dressed, sharpened and cleaned during the grinding process. The maximum chipping space and the permanent, easy cutting grinding wheel topography of the SKYTEC BOLT enable tool inserts to be machined with maximum economic efficiency.
Features
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Low grinding forces:
The individually adapted specification for the grinding wheel and ongoing conditioning reduce the grinding forces.
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Minimal chipping:
The use of small grit sizes leads to a significant reduction in cutting edge chipping, with constant economic efficiency.
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Shorter grinding time:
Specially adapted diamond grains and the newly developed metal bond in combination with the PowerGrind process enable you to reduce grinding time by up to 50%.
Abrasive Grain
- Diamond (D)
Bond Classification
Metal
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