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Product information
Description
The resin-bonded lappers are primarily used for deburring and lapping extremely hard materials. They are therefore the common choice for whetting tungsten carbide cutting edges. This product is only available in a diamond grain design with a grit size of D35.
Applications
- For deburring and lapping very hard materials, primarily for trueing carbide cutting edges
Abrasive Grain
- Diamond (D)
Bond Classification
Resin
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