We appreciate your interest and will get back to you as soon as possible to prepare a quote. In the meantime, feel free to discover more products on our website.
Product information
Description
In combination with specific process adjustments an outstanding economic efficiency can be reached.
Features
-
Improved Die Strength Ratio:
The combination of a grit size of only 1 μ, optimized diamond quality with specific bond system and a special core design, allows to reach extremely high Die Strength Ratios during the wafer production.
-
Shorter Grinding times:
The use of best diamond qualities embedded in a high performance bond system delivers higher stock removal rates and shorter grinding cycles.
-
Stock range:
To ensure rapid availability, Tyrolit offers a comprehensive stock range of standard specifications.
Download Hub
Flyer
- English (US)
Recommendations
Explore related products
Flexible elastic grinding tools with resinoid bond
for finishing implants and toolsFine grinding
Silicon carbide grinding tools in self-sharpening resin bonding systems
for the machining of hypodermic needlesFine grinding