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Backgrinding Wheels for the Semiconductor Industry

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Product information

Description

In combination with specific process adjustments an outstanding economic efficiency can be reached.

Features

  • Improved Die Strength Ratio:

    The combination of a grit size of only 1 μ, optimized diamond quality with specific bond system and a special core design, allows to reach extremely high Die Strength Ratios during the wafer production.

  • Shorter Grinding times:

    The use of best diamond qualities embedded in a high performance bond system delivers higher stock removal rates and shorter grinding cycles.

  • Stock range:

    To ensure rapid availability, Tyrolit offers a comprehensive stock range of standard specifications.

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