With its assortment for grinding wafers and a partnership with diamond tool manufacturer Asahi, Tyrolit has established itself as an innovative partner to the semiconductor industry. Both companies use synergy effects from which customers benefit worldwide.
The composition of our abrasives with an optimized diamond quality, a special bond system and a unique carrier body design, which is manufactured by Asahi, guarantees lowest grinding forces during the grinding process. In combination with a grit size of less than 1 μm results in improved surface quality and greatly increased flexural strength of up to 100%.
In addition, our specialists will help you to make process adjustments and thus achieve excellent profitability of your production.
